Wafer Manufacturing: Shaping of Single Crystal Silicon Wafers, ウェハー製造: 単結晶シリコンウェハーの成形, 9783527823246, 978-3-527-82324-6【電子書籍 / 1ユーザー】
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Description
Presenting all the major stages in wafer manufacturing, from crystals to prime wafers.
This book first outlines the physics, associated metrology, process modelling and quality requirements and the goes on to discuss wafer forming and wafer surface preparation techniques. The whole is rounded off with a chapter on the research and future challenges in wafer manufacturing.
Contents:
Part I From Crystal to Prime Wafers
1 Wafers and Semiconductors
2 Wafer Manufacturing: Generalized Processes and Flow
3 Process Modeling and Manufacturing Processes
Part II Wafer Forming
4 Wafer Slicing Using a Modern Slurry Wiresaw and Other Saws
5 Modeling of the Wiresaw Manufacturing Process and Material Characteristics
6 Diamond-Impregnated Wire Saws and the Sawing Process
Part III Wafer Surface Preparation and Management
7 Lapping
8 Chemical Mechanical Polishing
9 Grinding, Edge Grinding, Etching, and Surface Cleaning
10 Wafer Metrology and Optical Techniques
11 Conclusion